Camtek says AI chip packaging orders point to over $800 million in 2027 sales

On 14 October 2026 Camtek, an Israeli company that makes machines to inspect and measure chips while they are being made, said its third-quarter revenue should come in at 160 to 161 million dollars. That is above what it had guided and up 27% from a year earlier, and Camtek called it a record.

It expects about 180 million dollars in the fourth quarter, up 40%, and about 595 million dollars for all of 2026. Camtek said it has taken orders of over 800 million dollars since January, with deliveries running into 2027. On that basis it gave a first outlook for 2027 of over 800 million dollars in sales, more than 35% above 2026.

A quick explainer: advanced packaging is the step where several chips are stacked or placed side by side in one package, such as stacks of high-bandwidth memory (HBM) chips, the fast memory used in AI products. Camtek's machines check those chips and packages for defects. Its CEO said the orders were driven by very strong demand for advanced packaging for AI.

Why we file it. This is a company putting a number on next year's demand, backed by orders it already holds, from the packaging step of the AI chip chain.

How we read it. Camtek turns green on the map. It is one equipment maker, so read it as one clear data point from the packaging step, not a measure of the whole market.

Why it matters to you: when the companies that check AI chip packages are this busy, it is one sign that more AI computing power is being built for the apps you use.

What would change this: full third-quarter results in early November coming in below this preview, the 2027 outlook being cut, or customers pushing out deliveries.