Chip manufacturing, memory and packaging
The foundries, memory makers, and packaging and testing businesses that physically manufacture AI chips. This is where a chip design actually becomes a real, physical piece of silicon.
Every connection below is tied to a readable source, date, classification and statement of its limits. A company source establishes what that company stated. It does not necessarily provide independent confirmation.
GlobalFoundries manufactures silicon germanium optical-connectivity chips for Marvell Technology
GlobalFoundries and Marvell said they expanded their multi-year strategic agreement to increase silicon germanium manufacturing capacity at GF's Burlington, Vermont fab for optical connectivity products, after more than a decade of collaboration.
Source: 2026-09-17 · reviewed 2026-09-26
Evidence: Primary-source statement · Reported operating; capacity expansion announced
Limits: Does not disclose volumes, contract value, or the share of Marvell's optical products made at GF; the added capacity is not yet confirmed as delivered.
GlobalFoundries and Marvell expand collaboration for next-generation optical connectivity ↗
Samsung Electronics led a funding round in Mistral AI
Samsung Electronics led Mistral AI's approximately €3 billion Series D funding round, valuing Mistral at over €21 billion (about $24 billion), alongside co-investors including Nvidia and Salesforce Ventures.
Source: 2026-09-08 · reviewed 2026-09-20
Evidence: Primary-source statement · Completed funding round as of announcement
Limits: Confirms Samsung led the round and the round's total size and valuation; does not establish Samsung's individual investment amount, resulting ownership percentage, or board rights.
Sandisk co-develops the High Bandwidth Flash standard with SK hynix
Sandisk said it and SK hynix released the first High Bandwidth Flash (HBF) technical specification through the Open Compute Project.
Source: 2026-08-03 · reviewed 2026-09-26
Evidence: Primary-source statement · Joint specification published
Limits: Establishes joint work on a published specification only; does not establish that HBF products are shipping, which company will manufacture them, or any commercial terms between the two.
SK hynix holds convertible bonds in Kioxia
SK hynix's July 2026 US prospectus says it holds a convertible bond issued by BCPE Pangea Cayman2, a Bain-led consortium vehicle that owns Kioxia shares, convertible into about 15.0% of that vehicle; its other Kioxia holding vehicle sold all its remaining Kioxia shares in June 2026.
Source: 2026-07-10 · reviewed 2026-09-27
Evidence: Primary-source statement · Reported holding; bonds not converted
Limits: An indirect interest: the bond converts into about 15.0% of a holding vehicle that owns Kioxia shares, not into Kioxia shares directly. Does not establish SK hynix's look-through percentage of Kioxia, board influence or any supply relationship.
Tower Semiconductor manufactures coherent photonic ICs for Marvell Technology
Tower Semiconductor said it has shipped more than five million coherent photonic integrated circuits, made on its silicon photonics platform, to Marvell's global customers.
Source: 2026-06-18 · reviewed 2026-09-26
Evidence: Primary-source statement · Reported operating
Limits: Cumulative shipment milestone; does not disclose revenue, pricing, Tower's share of Marvell's photonics supply, or future volumes.
Tower Semiconductor and Marvell Ship Over Five Million Coherent Photonic ICs ↗
Amkor Technology packages chips for Credo
Credo's fiscal 2026 annual report names Amkor, alongside ASE, as a packaging provider for its chips.
Source: 2026-06-15 · reviewed 2026-09-26
Evidence: Primary-source statement · Reported operating (fiscal 2026)
Limits: Does not establish which products Amkor packages, volumes, or the split of work between Amkor and ASE.
Credo Technology Group Holding Ltd Form 10-K for fiscal year ended May 2, 2026 ↗