COMPANIES · AI CHIPS & NETWORKING

Credo

Credo designs high-speed connectivity chips and products, including active electrical cables, optical DSPs and SerDes technology, that move data between servers, switches and GPUs in data centers.

EnablerAI chips & networking
What it does

Credo designs high-speed connectivity chips and products, including active electrical cables, optical DSPs and SerDes technology, that move data between servers, switches and GPUs in data centers.

Why it matters

AI clusters need huge numbers of fast, reliable links, and Credo's copper and optical interconnect products run at up to 1.6T for AI data infrastructure. Its revenue is highly concentrated, with its top ten customers accounting for about 90% of fiscal 2026 revenue.

How it makes money

Hyperscalers, equipment makers and cable/module makers pay it for active electrical cables, integrated circuits and connectivity products.

Geography

United States (San Jose, California; registered in the Cayman Islands)

AI stack position

AI chips and networking. The companies designing the processors, accelerators and networking equipment that do the actual computing behind AI, including GPUs like NVIDIA's, and the high-speed connections that link thousands of them together.

Same-layer peers

Same-layer peers share an editorial stack classification; that alone does not establish direct competition.

Connections (4)

Every connection below is tied to a readable source, date, classification and statement of its limits. A company source establishes what that company stated; it does not necessarily provide independent confirmation.

Current relationships (2)

TSMC fabricates wafers for Credo
Manufactures forCurrent
Credo's fiscal 2026 annual report names TSMC as its semiconductor wafer manufacturer.

Source: 2026-06-15 · reviewed 2026-09-26

Evidence: Primary-source statement · Reported operating (fiscal 2026)

Limits: Does not establish wafer volumes, process nodes for each product, pricing, or Credo's share of TSMC capacity.

Credo Technology Group Holding Ltd Form 10-K for fiscal year ended May 2, 2026 ↗
Amkor Technology packages chips for Credo
Manufactures forCurrent
Credo's fiscal 2026 annual report names Amkor, alongside ASE, as a packaging provider for its chips.

Source: 2026-06-15 · reviewed 2026-09-26

Evidence: Primary-source statement · Reported operating (fiscal 2026)

Limits: Does not establish which products Amkor packages, volumes, or the split of work between Amkor and ASE.

Credo Technology Group Holding Ltd Form 10-K for fiscal year ended May 2, 2026 ↗

Dated or announced (2)

Credo developed ZeroFlap Optics with Oracle
Co-develops withDated / announced
Credo's fiscal 2026 annual report says it partnered with Oracle to develop its ZeroFlap Optics.

Source: 2026-06-15 · reviewed 2026-09-26

Evidence: Primary-source statement · Co-development reported; deployment scale not disclosed

Limits: Does not establish that Oracle is a named 10%-plus customer, purchase volumes, or deployment scale.

Credo Technology Group Holding Ltd Form 10-K for fiscal year ended May 2, 2026 ↗
Credo created a switch cable implementation with Microsoft
Co-develops withDated / announced
Credo's fiscal 2026 annual report says it created a switch cable and open-sourced implementation with Microsoft.

Source: 2026-06-15 · reviewed 2026-09-26

Evidence: Primary-source statement · Co-development reported; deployment scale not disclosed

Limits: Does not establish that Microsoft buys the product, volumes, revenue, or exclusivity.

Credo Technology Group Holding Ltd Form 10-K for fiscal year ended May 2, 2026 ↗

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Inclusion in this database is not an endorsement of a company or its securities. Nothing here is a recommendation to buy or sell anything, and none of it is individualized investment advice. See the disclosures. Data: AI Map v3.24, released .