TSMC

Source: 2026-08-12 · reviewed 2026-09-22

Evidence: Secondary reporting (unconfirmed by primary parties) · Reported operating

Limits: Press reporting, not a joint statement from TSMC or AMD naming the arrangement; discloses no contract terms, wafer volumes, or exclusivity.

Source: 2026-03-05 · reviewed 2026-09-22

Evidence: Secondary reporting (unconfirmed by primary parties) · Reported operating

Limits: Trade-press reporting rather than a direct statement from TSMC or Broadcom; no volumes, contract value, or product names are disclosed.

Source: 2026-01-27 · reviewed 2026-09-22

Evidence: Secondary reporting (unconfirmed by primary parties) · Reported operating

Limits: Does not confirm order volumes or exclusivity; TSMC does not comment on individual customers, and Microsoft's own materials do not name the foundry.

Source: 2025-10-21 · reviewed 2026-09-22

Evidence: Secondary reporting (unconfirmed by primary parties) · Reported operating

Limits: Does not confirm volumes or exclusivity; TSMC does not comment on individual customers and this is based on supply-chain analyst reporting.

Source: 2025-04-14 · reviewed 2026-09-17

Evidence: Primary-source statement · Reported operating

Limits: Does not establish volumes, pricing or exclusivity.

Source: 2024-03-27 · reviewed 2026-09-24

Evidence: Primary-source statement · Reported operating

Limits: Establishes that tape-out began with TSMC as of March 2024. It does not establish the process node, volumes, pricing, that the chip reached volume production or flight, or that the relationship continues today; the source is more than two years old.

Source: 2023-11-30 · reviewed 2026-09-22

Evidence: Secondary reporting (unconfirmed by primary parties) · Reported operating

Limits: Does not confirm exact process node, order volumes, or a direct contractual relationship, since TSMC declined to comment on individual customers; attribution rests on supply-chain analyst reporting.

Source: 2023-03-21 · reviewed 2026-09-22

Evidence: Primary-source statement · Reported operating

Limits: Does not disclose how broadly cuLitho has been deployed across TSMC's fabs, financial terms, or whether coverage now extends beyond the initially announced Hopper-generation production.

Source: 2022-07-14 · reviewed 2026-09-20

Evidence: Secondary reporting (unconfirmed by primary parties) · Reported operating

Limits: This reflects industry reporting on foundry allocation for specific chip generations; it does not prove TSMC manufactures all current Qualcomm products, since Qualcomm has also used Samsung Foundry for some chips, and neither company has published exhaustive volume or exclusivity details.

Source: 2021-05-26 · reviewed 2026-09-22

Evidence: Primary-source statement · Reported operating

Limits: Certification of design tools for a process node does not indicate how many chips are actually taped out with these tools, deal value, or exclusivity versus other EDA vendors.

Source: 2020-08-25 · reviewed 2026-09-22

Evidence: Primary-source statement · Reported operating

Limits: Describes a 2020 5nm-generation agreement; does not establish whether the same manufacturing arrangement covers Marvell's current 2nm custom-silicon designs.

Source: Source undated · reviewed 2026-09-22

Evidence: Primary-source statement · Reported operating

Limits: Certification does not indicate specific customer tape-outs, revenue, or exclusivity between Cadence and TSMC; page content was accessed via search indexing rather than a direct fetch because cadence.com's robots rules blocked a live fetch in this session.

Source: 2026-07-09 · reviewed 2026-09-24

Evidence: Secondary reporting (unconfirmed by primary parties) · Reported but unconfirmed

Limits: Based on an internal document rather than a statement by Meta or TSMC, and Meta declined to comment. It does not establish the process node, wafer volumes, contract value, or that production actually began on schedule.

Source: 2026-06-16 · reviewed 2026-09-22

Evidence: Primary-source statement · Announced / planned

Limits: Does not disclose contract value, packaging volumes, or the share of TSMC's total advanced-packaging demand Amkor will fulfill; the Arizona facilities are still under development.

Source: 2026-04-16 · reviewed 2026-09-24

Evidence: Secondary reporting of an on-record executive statement · Announced; not confirmed operating

Limits: Tape-out is a design milestone, not production. This does not establish that TSMC has manufactured any AI5 volume, which TSMC fab or node will be used, the contract value, or how output will be split between TSMC and Samsung.

Source: 2024-12-02 · reviewed 2026-09-17

Evidence: Primary-source statement · Supplier relationship documented

Limits: Supports a supplier relationship in 2024, not current contract terms, spend, exclusivity or dependency.

Source: 2024-12-02 · reviewed 2026-09-17

Evidence: Primary-source statement · Supplier relationship documented

Limits: Supports a supplier relationship in 2024, not current contract terms, spend, exclusivity or dependency.

Source: 2024-12-02 · reviewed 2026-09-17

Evidence: Primary-source statement · Supplier relationship documented

Limits: Supports a supplier relationship in 2024, not current contract terms, spend, exclusivity or dependency.

Source: 2024-12-02 · reviewed 2026-09-17

Evidence: Primary-source statement · Supplier relationship documented

Limits: Supports a supplier relationship in 2024, not current contract terms, spend, exclusivity or dependency.

Source: Source undated · reviewed 2026-09-20

Evidence: Secondary reporting (unconfirmed by primary parties) · Reported dual-sourcing plan, 2026

Limits: The dual-sourcing claim has not been confirmed directly by Tesla or TSMC in an on-record statement; volumes and timing are not established by this source.

Source: 2026-07-30 · reviewed 2026-09-22

Evidence: Analytical comparison · Reported operating

Limits: Market-share and yield figures are this outlet's estimates, not disclosed by either company; does not establish exclusivity or predict the outcome of Samsung's competitive push.