COMPANIES · CHIP MFG & PACKAGING
Samsung Electronics
Makes memory, storage and processor products and operates a semiconductor foundry.
Makes memory, storage and processor products and operates a semiconductor foundry.
It is a top global supplier of memory and also operates its own chip foundry, giving it exposure to both the memory and manufacturing layers of the AI stack.
Sells memory chips, storage and semiconductor foundry services.
South Korea
Chip manufacturing, memory and packaging. The foundries, memory makers, and packaging and testing businesses that physically manufacture AI chips. This is where a chip design actually becomes a real, physical piece of silicon.
Connections (27)
Every connection below is tied to a readable source, date, classification and statement of its limits. A company source establishes what that company stated; it does not necessarily provide independent confirmation.
Current relationships (10)
Source: 2026-09-08 · reviewed 2026-09-20
Evidence: Primary-source statement · Completed funding round as of announcement
Limits: Confirms Samsung led the round and the round's total size and valuation; does not establish Samsung's individual investment amount, resulting ownership percentage, or board rights.
Mistral raises €3B as sovereign AI becomes big business ↗Source: 2026-06-30 · reviewed 2026-09-22
Evidence: Primary-source statement · Reported operating
Limits: Does not specify which Samsung products will incorporate the licensed IP, license fees, or timeline; this is separate from Samsung Electronics' existing equity investment in Tenstorrent.
Tenstorrent Sets New Performance Records, Launches TT-Ascalon S, and Expands Across Japan ↗Source: 2026-05-28 · reviewed 2026-09-20
Evidence: Primary-source statement · Active, longstanding co-innovation partnership reaffirmed at SAFE Forum 2026
Limits: Describes a longstanding co-innovation partnership and specific process-node tool certification with quoted efficiency figures; does not disclose license revenue, exclusivity, or independently verify the 20% figure beyond the companies' own claim.
Synopsys Advances Power and Performance for AI and Multi-Die Designs on Latest Samsung Foundry Processes at SAFE Forum 2026 ↗Source: 2026-05-28 · reviewed 2026-09-22
Evidence: Primary-source statement · Reported operating
Limits: Describes an expanded design-technology collaboration; page content was accessed via search indexing of Cadence's own press release title rather than a direct fetch (cadence.com blocked live fetches in this session), and no financial terms or specific customer tape-outs are disclosed.
Cadence and Samsung Foundry Deepen 2nm and 3D-IC Collaboration to Meet Surging AI Infrastructure and Physical AI Demand ↗Source: 2026-04-18 · reviewed 2026-09-22
Evidence: Secondary reporting (unconfirmed by primary parties) · Reported operating
Limits: Aggregate sales-mix reporting; does not break out Samsung-specific order value, machine counts, or contract terms.
ASML Sees Memory Chip Orders Explode Past Logic for the First Time as DRAM Makers Scramble for EUV Slots ↗Source: 2026-02-11 · reviewed 2026-09-20
Evidence: Primary-source statement · Founding member of active joint R&D center
Limits: Confirms Samsung's founding membership and the R&D scope described; does not disclose Samsung's investment amount or any equipment purchase commitments tied to the center.
Applied Materials Announces Samsung Electronics Will Join the New, Multibillion-Dollar EPIC Center in Silicon Valley ↗Source: 2026-02-11 · reviewed 2026-09-22
Evidence: Primary-source statement · Reported operating
Limits: Describes joint R&D program membership, not a specific equipment purchase order, Samsung's dollar commitment, or exclusivity versus other EPIC Center members.
Applied Materials Announces Samsung Electronics Will Join the New, Multibillion-Dollar EPIC Center in Silicon Valley ↗Source: 2026-01-15 · reviewed 2026-09-24
Evidence: Secondary reporting (unconfirmed by primary parties) · Reported operating
Limits: Trade reporting of a funding announcement. It does not establish the amount invested, which Samsung entity invested, the stake acquired, or any product relationship.
Skild AI raises $1.4B, building 'omni-bodied' robot Skild Brain ↗Source: 2025-06-17 · reviewed 2026-09-20
Evidence: Primary-source statement · Active, multi-year IP and tool-certification agreement
Limits: Confirms tool/IP certification and joint optimization work described in the release; does not disclose license fees or which specific Samsung Foundry customers use these certified flows.
Cadence Accelerates SoC, 3D-IC and Chiplet Design for AI Data Centers, Automotive and Connectivity in Collaboration with Samsung Foundry ↗Source: 2025-06-13 · reviewed 2026-09-20
Evidence: Secondary reporting of an on-record executive statement · Active as of AMD's June 2025 confirmation
Limits: Based on media reporting of AMD's own public statement; does not disclose shipment volumes, pricing, or the relative split between Samsung and Micron as suppliers.
Samsung supplies HBM3E to AMD's new accelerators ↗Dated or announced (14)
Source: 2026-09-11 · reviewed 2026-09-22
Evidence: Secondary reporting (unconfirmed by primary parties) · Reported talks
Limits: Describes ongoing negotiations, not a signed contract; timing and pricing remain unresolved, and the claim is sourced to a Korean outlet (The Bell) via trade press, not confirmed directly by Samsung or Qualcomm.
Samsung-Qualcomm 2nm Deal May Slip to 2027; Foundry Resists Lower Pricing as Process Stabilizes ↗Source: 2026-09-10 · reviewed 2026-09-22
Evidence: Secondary reporting of an on-record executive statement · Announced / planned
Limits: Samsung declined to confirm or deny customer-specific details; whether Samsung will manufacture OpenAI's logic chips (versus just supplying HBM samples) is unconfirmed and raised only as a possibility tied to Samsung's separate Broadcom foundry MOU.
OpenAI Adds Samsung Foundry to Its Silicon Program, Closing TSMC-Only Risk ↗Source: 2026-09-08 · reviewed 2026-09-20
Evidence: Primary-source statement · Collaboration expansion announced Sept 2026; DRAM High-NA EUV production is a stated 2028 target, not yet operating
Limits: Describes a joint technology roadmap and R&D announcement; does not disclose tool order volumes, pricing, or confirm the 2028 DRAM production target has been met.
Samsung Electronics and ASML Expand Strategic Collaboration for Next-Generation Semiconductor Manufacturing ↗Source: 2026-07-25 · reviewed 2026-09-20
Evidence: Primary-source statement · MOU signed July 2026; deliveries and production phased through 2030, not yet a confirmed operating supply relationship
Limits: Reflects a signed MOU with a 2030 horizon; does not confirm that HBM shipments or foundry production for Broadcom have begun, nor how the $200B figure breaks down by year or product line.
Samsung Electronics and Broadcom Expand Strategic Collaboration Across Memory and Foundry Technologies ↗Source: 2026-07-25 · reviewed 2026-09-22
Evidence: Primary-source statement · Announced / planned
Limits: This is a memorandum of understanding, not a completed or binding supply contract; the $200B figure spans both memory and foundry over five years and is not a confirmed, itemized order.
Samsung Electronics and Broadcom Expand Strategic Collaboration Across Memory and Foundry Technologies ↗Source: 2026-07-09 · reviewed 2026-09-24
Evidence: Secondary reporting (unconfirmed by primary parties) · Reported but unconfirmed
Limits: Neither Meta nor Samsung confirmed this. It does not establish the memory type or capacity, order volumes, contract value, or whether Samsung is one of several memory suppliers for the part.
Meta's new AI chips will begin production in September ↗Source: 2026-06-17 · reviewed 2026-09-22
Evidence: Secondary reporting (unconfirmed by primary parties) · Reported talks
Limits: Preliminary, unconfirmed discussions per anonymous sourcing; not a signed agreement, and no process node, volume, or timeline beyond '2028' is confirmed.
Samsung Foundry Reportedly in Talks with AMD for 2028 CPU Production as BYD, Google Consider Its Services ↗Source: 2025-07-28 · reviewed 2026-09-24
Evidence: Secondary reporting of an on-record executive statement · Announced; not confirmed operating
Limits: A contract announcement described by Musk on X. It does not establish that any AI6 wafers have been produced, that the $16.5 billion will actually be spent, what the per-unit economics are, or that Samsung is Tesla's only AI6 source.
Elon Musk says Tesla and Samsung have signed a $16.5 billion chip deal ↗Source: 2024-12-31 · reviewed 2026-09-24
Evidence: Primary-source statement · Announced; not confirmed operating
Limits: This is an announcement of intent to exercise a call option. It does not establish that the transaction completed, the current shareholding, the price paid, or that any Samsung AI technology has been integrated into Rainbow Robotics products.
Samsung Electronics To Become Largest Shareholder in Rainbow Robotics ↗Source: 2024-08-05 · reviewed 2026-09-22
Evidence: Primary-source statement · Announced
Limits: Investment was made through Samsung Catalyst Fund rather than Samsung Electronics' balance sheet directly; individual amount not disclosed. This is distinct from Samsung Electronics' separate foundry/manufacturing relationship with Groq.
Groq Raises $640M to Meet Soaring Demand for Fast AI Inference ↗Source: 2023-08-15 · reviewed 2026-09-20
Evidence: Primary-source statement · Manufacturing agreement announced in 2023 as a forward-looking commitment; current production status not reconfirmed by a newer joint statement
Limits: The original announcement describes a forward-looking manufacturing commitment for next-generation chips; it does not by itself confirm current wafer volumes, exclusivity, or that production is presently active.
Groq Selects Samsung Foundry to Bring Next-gen LPU to the AI Acceleration Market ↗Source: 2023-08-02 · reviewed 2026-09-20
Evidence: Primary-source statement · Completed
Limits: This confirms one funding round co-led by Samsung's venture arm; it does not establish an ownership percentage, a supply relationship, or that Samsung Electronics as a whole has an operating partnership with Tenstorrent.
Tenstorrent Raises a $100M Strategic Up-round Co-led by Hyundai Motor Group and the Samsung Catalyst Fund ↗Source: 2019-12-18 · reviewed 2026-09-20
Evidence: Primary-source statement · Dated: first-generation Kunlun chip foundry announcement, December 2019; mass production targeted early 2020. Not confirmed as Baidu's current/sole foundry relationship.
Limits: Confirms Samsung as foundry for Baidu's first-generation Kunlun chip only (2019 announcement, 2020 production target). Does not establish whether Samsung remains Baidu's foundry for later Kunlun generations (Kunlun II, III), order volumes, contract value, or that this relationship is operating in 2026.
Baidu and Samsung Electronics Ready for Production of Leading-Edge AI Chip for Early Next Year (Samsung Newsroom, Dec 18, 2019) ↗Source: Source undated · reviewed 2026-09-20
Evidence: Secondary reporting (unconfirmed by primary parties) · Reported tape-out / early production, 2026
Limits: Neither Tesla nor Samsung has issued an on-record joint statement confirming volumes, exclusivity, or contract terms; reporting rests on supply-chain and trade-press sources.
Samsung Foundry Unofficially Confirms Tesla AI5 Tape-Out, Production To Start Soon in Texas ↗Comparisons (3)
Source: 2026-09-21 · reviewed 2026-09-22
Evidence: Analytical comparison · Reported operating
Limits: Share and yield figures are as reported by this outlet, not disclosed directly by either company in the cited article.
Samsung Narrows HBM Gap With SK hynix to 17 Points ↗Source: 2026-07-30 · reviewed 2026-09-22
Evidence: Analytical comparison · Reported operating
Limits: Market-share and yield figures are this outlet's estimates, not disclosed by either company; does not establish exclusivity or predict the outcome of Samsung's competitive push.
Samsung's $200 Billion Broadcom Deal Is a Bid to Break TSMC's AI Foundry Lock ↗Source: 2025-04-13 · reviewed 2026-09-22
Evidence: Analytical comparison · Reported operating
Limits: Share figures are as reported by this outlet, not company-disclosed, and describe 2024-2025 market share which may have shifted since.
Micron makes aggressive HBM push to challenge Samsung, SK ↗Samsung listing information ↗
Reviewed
Inclusion in this database is not an endorsement of a company or its securities. Nothing here is a recommendation to buy or sell anything, and none of it is individualized investment advice. See the disclosures. Data: AI Map v3.22, released .