COMPANIES · CHIP MFG & PACKAGING
Micron
Makes memory and storage products, including high-bandwidth memory for AI accelerators.
Makes memory and storage products, including high-bandwidth memory for AI accelerators.
It is one of three global suppliers of the high-bandwidth memory that AI accelerators need to move data fast enough to keep GPUs busy.
Sells memory and storage products, including HBM, to computing and AI-hardware customers.
United States
Chip manufacturing, memory and packaging. The foundries, memory makers, and packaging and testing businesses that physically manufacture AI chips. This is where a chip design actually becomes a real, physical piece of silicon.
Connections (8)
Every connection below is tied to a readable source, date, classification and statement of its limits. A company source establishes what that company stated; it does not necessarily provide independent confirmation.
Current relationships (5)
Source: 2026-04-18 · reviewed 2026-09-22
Evidence: Secondary reporting (unconfirmed by primary parties) · Reported operating
Limits: Aggregate sales-mix reporting; does not break out Micron-specific order value or machine counts, and Micron only adopted EUV in its DRAM process starting around 2024-2025.
ASML Sees Memory Chip Orders Explode Past Logic for the First Time as DRAM Makers Scramble for EUV Slots ↗Source: 2026-03-16 · reviewed 2026-09-22
Evidence: Primary-source statement · Reported operating
Limits: Does not disclose shipment volumes, pricing, or whether NVIDIA is the exclusive customer for this specific HBM4 configuration.
Micron in High-Volume Production of HBM4 Designed for NVIDIA Vera Rubin, PCIe Gen6 SSD and SOCAMM2 ↗Source: 2026-01-30 · reviewed 2026-09-22
Evidence: Primary-source statement · Reported operating
Limits: Describes a technical IP-integration collaboration; does not disclose commercial terms or which shipping Micron products use this Cadence IP.
Advancing DLEP verification and compliance with Cadence Design Systems ↗Source: 2025-12-08 · reviewed 2026-09-20
Evidence: Primary-source statement · Active, currently recognized supplier relationship
Limits: Confirms an active, recognized equipment-supply relationship; does not disclose contract value, equipment volumes, or which specific Micron fabs or nodes the equipment serves.
Lam Research Wins 2025 Micron Outstanding Front End Equipment Supplier Award ↗Source: 2025-06-12 · reviewed 2026-09-20
Evidence: Primary-source statement · Active, shipping design-in as of mid-2025
Limits: Confirms design-in and product integration with on-record quotes from both companies; does not disclose purchase volumes, contract value, or Micron's share of AMD's total HBM sourcing versus Samsung.
Micron HBM Designed into Leading AMD AI Platform ↗Dated or announced (1)
Source: 2024-02-26 · reviewed 2026-09-17
Evidence: Primary-source statement · Product supply announced
Limits: Source announced future H200 shipments. Not current market share or an exclusive supply agreement.
Micron HBM3E volume production ↗Comparisons (2)
Source: 2025-04-13 · reviewed 2026-09-22
Evidence: Analytical comparison · Reported operating
Limits: Share figures are as reported by this outlet, not company-disclosed, and describe 2024-2025 market share which may have shifted since.
Micron makes aggressive HBM push to challenge Samsung, SK ↗Source: 2025-04-13 · reviewed 2026-09-22
Evidence: Analytical comparison · Reported operating
Limits: Share figures are as reported by this outlet, not company-disclosed, and describe 2024-2025 market share which may have shifted since.
Micron makes aggressive HBM push to challenge Samsung, SK ↗Inclusion in this database is not an endorsement of a company or its securities. Nothing here is a recommendation to buy or sell anything, and none of it is individualized investment advice. See the disclosures. Data: AI Map v3.22, released .