COMPANIES · CHIP MFG & PACKAGING

Micron

In the AI Economy Index: Major, 3.00% (as of 2 October 2026)

Makes memory and storage products, including high-bandwidth memory for AI accelerators. Fiscal 2026 revenue $133.19bn; fiscal Q4 $54.23bn. Says it has completed agreements for the vast majority of its calendar 2027 HBM bit supply.

EnablerChip mfg & packaging
What it does

Makes memory and storage products, including high-bandwidth memory for AI accelerators. Fiscal 2026 revenue $133.19bn; fiscal Q4 $54.23bn. Says it has completed agreements for the vast majority of its calendar 2027 HBM bit supply.

Why it matters

It is one of three global suppliers of the high-bandwidth memory that AI accelerators need to move data fast enough to keep GPUs busy.

How it makes money

Sells memory and storage products, including HBM, to computing and AI-hardware customers.

Geography

United States

AI stack position

Chip manufacturing, memory and packaging. The foundries, memory makers, and packaging and testing businesses that physically manufacture AI chips. This is where a chip design actually becomes a real, physical piece of silicon.

What would change our view

Our view would change if Micron disclosed that agreements for the vast majority of its calendar 2027 high-bandwidth memory bit supply had been reduced or ended. It would also change if high-volume shipment of its HBM4, designed for NVIDIA's Vera Rubin platform, were disclosed as stopped, or if its work with NVIDIA on a custom HBM4E, NV-HBM, were disclosed as ended. A disclosed cancellation of the Strategic Customer Agreements named in its 30 September 2026 earnings release, or a disclosed early return of the customer contract deposits in that release, would change it too: noncurrent customer contract liabilities were $12.895 billion at 3 September 2026, up from $568 million at 28 May 2026, and the year's financing cash flow includes $12.747 billion of proceeds from those deposits.

Things anyone could observe that would change how this map describes the company. They are not forecasts, and they are not a view on the company's securities.

Source: Micron Technology, Inc. earnings release for the quarter ended 3 September 2026 (Exhibit 99.1 to the Form 8-K filed 30 September 2026) ↗

Connections (11)

Every connection below is tied to a readable source, date, classification and statement of its limits. A company source establishes what that company stated; it does not necessarily provide independent confirmation.

Current relationships (6)

ASML supplies EUV lithography systems to Micron
SuppliesCurrent
Micron said in June 2026 that it had concluded a multi-year EUV supply agreement with ASML, supporting its increased adoption of EUV at the 1-delta DRAM node and future generations.

Source: 2026-06-24 · reviewed 2026-09-27

Evidence: Primary-source statement · Multi-year supply agreement concluded (announced June 2026)

Limits: Does not disclose order value, tool counts or delivery schedule.

Micron fiscal Q3 2026 prepared remarks ↗
Micron supplies HBM4 memory for Vera Rubin to NVIDIA
SuppliesCurrent
Micron began high-volume shipment of HBM4 36GB 12-high memory designed for NVIDIA's Vera Rubin platform in Q1 calendar 2026, with bandwidth above 2.8 TB/s.

Source: 2026-03-16 · reviewed 2026-09-27

Evidence: Primary-source statement · Reported operating

Limits: Micron says the HBM4 is designed for NVIDIA Vera Rubin and in volume shipment, but does not name NVIDIA as the buyer or disclose volumes, pricing or exclusivity.

Micron in High-Volume Production of HBM4 Designed for NVIDIA Vera Rubin, PCIe Gen6 SSD and SOCAMM2 ↗
Micron integrates memory controller IP from Cadence Design Systems
Uses technology fromCurrent
Micron and Cadence Design Systems collaborated to integrate Direct Link ECC Protocol (DLEP) functionality into Cadence's LPDDR5/5X memory controller, PHY and verification IP, targeting AI, automotive and data-center memory systems.

Source: 2026-01-30 · reviewed 2026-09-22

Evidence: Primary-source statement · Reported operating

Limits: Describes a technical IP-integration collaboration; does not disclose commercial terms or which shipping Micron products use this Cadence IP.

Advancing DLEP verification and compliance with Cadence Design Systems ↗
Lam Research recognized as top front-end equipment supplier to Micron
SuppliesCurrent
Lam Research won Micron's 2025 'Outstanding Front End Equipment Supplier of the Year' award, its third such recognition, selected from more than 8,000 Micron suppliers for equipment supporting advanced memory nodes.

Source: 2025-12-08 · reviewed 2026-09-20

Evidence: Primary-source statement · Active, currently recognized supplier relationship

Limits: Confirms an active, recognized equipment-supply relationship; does not disclose contract value, equipment volumes, or which specific Micron fabs or nodes the equipment serves.

Lam Research Wins 2025 Micron Outstanding Front End Equipment Supplier Award ↗
Micron supplies HBM3E memory to AMD
SuppliesCurrent
Micron's HBM3E 36GB 12-high high-bandwidth memory has been designed into AMD's Instinct MI350 Series AI accelerators, delivering up to 8 TB/s of memory bandwidth per Micron and AMD's joint announcement.

Source: 2025-06-12 · reviewed 2026-09-20

Evidence: Primary-source statement · Active, shipping design-in as of mid-2025

Limits: Confirms design-in and product integration with on-record quotes from both companies; does not disclose purchase volumes, contract value, or Micron's share of AMD's total HBM sourcing versus Samsung.

Micron HBM Designed into Leading AMD AI Platform ↗
Rambus licenses its patent portfolio to Micron
SuppliesCurrent
Rambus announced a five-year extension of its patent license agreement with Micron, running through late 2029.

Source: 2024-12-10 · reviewed 2026-09-26

Evidence: Primary-source statement · Reported operating (agreement term)

Limits: Patent license only; does not establish fees paid, product purchases, or use in any specific Micron product.

Rambus and Micron Technology Extend Patent License Agreement ↗

Dated or announced (2)

Microchip Technology demonstrated a PCIe Gen 6 storage architecture with Micron
Co-develops withDated / announced
Microchip said it demonstrated, with Micron, an end-to-end PCIe Gen 6 storage architecture pairing its Switchtec Gen 6 PCIe switches with Micron 9650 NVMe SSDs at the 2026 Future of Memory and Storage conference.

Source: 2026-08-04 · reviewed 2026-09-26

Evidence: Primary-source statement · Technology demonstration; not a joint shipping product

Limits: A trade-show demonstration; does not establish a commercial agreement, joint product, customer deployments or revenue for either company.

Microchip Technology, in Collaboration With Micron Technology, Demonstrates High-Performance PCIe Gen 6 Storage Architecture for AI and Data Center Infrastructure ↗
Micron announced memory supply for NVIDIA
SuppliesDated / announced
Micron HBM3E was selected for NVIDIA H200 GPUs.

Source: 2024-02-26 · reviewed 2026-09-17

Evidence: Primary-source statement · Product supply announced

Limits: Source announced future H200 shipments. Not current market share or an exclusive supply agreement.

Micron HBM3E volume production ↗

Comparisons (3)

CXMT competes in DRAM with Micron
Competes withComparison only
Reuters reported that CXMT ranks fourth in global DRAM with a 7.7% share, behind Samsung, SK hynix and Micron.

Source: 2026-07-15 · reviewed 2026-09-26

Evidence: Analytical comparison · Product/market overlap

Limits: Market overlap only; CXMT lags in high-bandwidth memory, and this does not establish head-to-head wins for specific customers.

Explainer-What is CXMT and how did it become China's DRAM champion? (Reuters via Yahoo Finance) ↗
Micron competes with SK hynix
Competes withComparison only
Micron has pushed aggressively into HBM to challenge SK hynix's market lead, becoming the second HBM supplier after SK hynix to ship 12-layer HBM3E to NVIDIA and targeting roughly 20% HBM market share, up from about 5.1% in 2024.

Source: 2025-04-13 · reviewed 2026-09-22

Evidence: Analytical comparison · Reported operating

Limits: Share figures are as reported by this outlet, not company-disclosed, and describe 2024-2025 market share which may have shifted since.

Micron makes aggressive HBM push to challenge Samsung, SK ↗
Micron competes with Samsung Electronics
Competes withComparison only
Micron has pushed aggressively into HBM to challenge Samsung's market position, becoming the second HBM supplier after SK hynix to ship 12-layer HBM3E to NVIDIA and targeting roughly 20% HBM market share, up from about 5.1% in 2024.

Source: 2025-04-13 · reviewed 2026-09-22

Evidence: Analytical comparison · Reported operating

Limits: Share figures are as reported by this outlet, not company-disclosed, and describe 2024-2025 market share which may have shifted since.

Micron makes aggressive HBM push to challenge Samsung, SK ↗

Explore it interactively

Open this profile in the database See it on the relationship map

Inclusion in this database is not an endorsement of a company or its securities. Nothing here is a recommendation to buy or sell anything, and none of it is individualized investment advice. See the disclosures. Data: AI Map v3.25.43, released .