COMPANIES · AI CHIPS & NETWORKING
Broadcom
Designs semiconductors and provides infrastructure software, including custom AI accelerators and networking products.
Designs semiconductors and provides infrastructure software, including custom AI accelerators and networking products.
It designs custom AI accelerator chips ('XPUs') for hyperscalers such as Google and Meta, giving those companies an alternative to buying finished GPUs from NVIDIA.
Sells semiconductors (including custom AI chips and networking silicon) and infrastructure software, increasingly with AI-related products as a large and fast-growing share of revenue.
United States
AI chips and networking. The companies designing the processors, accelerators and networking equipment that do the actual computing behind AI, including GPUs like NVIDIA's, and the high-speed connections that link thousands of them together.
Connections (11)
Every connection below is tied to a readable source, date, classification and statement of its limits. A company source establishes what that company stated; it does not necessarily provide independent confirmation.
Current relationships (2)
Source: 2026-04-14 · reviewed 2026-09-20
Evidence: Primary-source statement · Extended, ongoing multi-generation custom-silicon collaboration
Limits: Describes an extended development partnership and a multi-gigawatt capacity target; does not confirm current production volumes, unit economics, or which foundry fabricates the resulting chips.
Broadcom Announces Extended Partnership with Meta to Deploy Technology to Support Multi-Gigawatts of Meta's Custom Silicon, MTIA ↗Source: 2026-03-05 · reviewed 2026-09-22
Evidence: Secondary reporting (unconfirmed by primary parties) · Reported operating
Limits: Trade-press reporting rather than a direct statement from TSMC or Broadcom; no volumes, contract value, or product names are disclosed.
Broadcom-TSMC 3.5D AI chips give ASIC leader an early edge over Nvidia ↗Dated or announced (6)
Source: 2026-07-25 · reviewed 2026-09-20
Evidence: Primary-source statement · MOU signed July 2026; deliveries and production phased through 2030, not yet a confirmed operating supply relationship
Limits: Reflects a signed MOU with a 2030 horizon; does not confirm that HBM shipments or foundry production for Broadcom have begun, nor how the $200B figure breaks down by year or product line.
Samsung Electronics and Broadcom Expand Strategic Collaboration Across Memory and Foundry Technologies ↗Source: 2026-07-25 · reviewed 2026-09-22
Evidence: Primary-source statement · Announced / planned
Limits: This is a memorandum of understanding, not a completed or binding supply contract; the $200B figure spans both memory and foundry over five years and is not a confirmed, itemized order.
Samsung Electronics and Broadcom Expand Strategic Collaboration Across Memory and Foundry Technologies ↗Source: 2026-06-24 · reviewed 2026-09-24
Evidence: Primary-source statement · Announced; not confirmed operating
Limits: Announcement of a chip and a deployment target. It does not establish that any Jalapeno units have been produced or installed, the volumes or prices involved, or that Broadcom is OpenAI's only silicon partner.
OpenAI and Broadcom unveil LLM-optimized inference chip ↗Source: 2026-04-06 · reviewed 2026-09-20
Evidence: Secondary reporting (unconfirmed by primary parties) · Extended multi-year co-development and supply arrangement disclosed via securities filing and press reporting
Limits: Reporting on a securities disclosure describes contract duration and scope; it does not itself state unit volumes, dollar value, or exclusivity of the TPU relationship.
Broadcom agrees to expanded chip deals with Google, Anthropic ↗Source: 2026-04-06 · reviewed 2026-09-20
Evidence: Primary-source statement · New compute commitment announced by Anthropic; capacity to come online starting 2027
Limits: Confirms an expanded Google-Broadcom-Anthropic compute agreement and Broadcom's role as Google's TPU co-design partner; does not itself establish the precise gigawatt figures for each tranche, and should not be read as Broadcom directly renting or leasing compute capacity to Anthropic -- Google is the compute provider, Broadcom the silicon co-design partner.
Anthropic expands Google and Broadcom compute deal ↗Source: 2025-10-13 · reviewed 2026-09-20
Evidence: Primary-source statement · Definitive collaboration announced; deployment phased 2026-2029
Limits: Confirms a signed co-development and deployment plan; does not confirm current shipped accelerator volume, contract dollar value, or exclusivity.
OpenAI and Broadcom announce strategic collaboration to deploy 10 gigawatts of OpenAI-designed AI accelerators ↗Comparisons (3)
Source: 2026-08-20 · reviewed 2026-09-22
Evidence: Analytical comparison · Ongoing market competition
Limits: Market price reaction is used as evidence of perceived competitive overlap, not a statement by either company; does not establish relative market share.
Google-Marvell Deal Expands Custom Silicon Past the TPU ↗Source: 2024-03-17 · reviewed 2026-09-22
Evidence: Analytical comparison · Ongoing market competition
Limits: Reflects a 2024 market-structure analysis at the time of Astera Labs' IPO; does not reflect any later shift in relative market share.
Astera Labs IPO - The Next Connectivity Superhero or Steamrolled By Competition? ↗Source: Source undated · reviewed 2026-09-17
Evidence: Analytical comparison · Product comparison
Limits: Broadcom's custom-silicon business model is structurally different from NVIDIA's merchant-GPU model; this is a market-structure comparison, not a bilateral agreement.
Broadcom AI accelerator (XPU) custom compute ↗Broadcom Q3 FY2026 results ↗
Reviewed
Inclusion in this database is not an endorsement of a company or its securities. Nothing here is a recommendation to buy or sell anything, and none of it is individualized investment advice. See the disclosures. Data: AI Map v3.22, released .