COMPANIES · CHIP MFG & PACKAGING

Amkor Technology

Provides outsourced semiconductor packaging and testing services.

EnablerChip mfg & packaging
What it does

Provides outsourced semiconductor packaging and testing services.

Why it matters

Advanced packaging is a bottleneck step in producing AI chips, and Amkor is one of the few independent providers of this service at scale.

How it makes money

Charges chipmakers for outsourced packaging and testing of finished semiconductors.

Geography

United States

AI stack position

Chip manufacturing, memory and packaging. The foundries, memory makers, and packaging and testing businesses that physically manufacture AI chips. This is where a chip design actually becomes a real, physical piece of silicon.

Same-layer peers

Same-layer peers share an editorial stack classification; that alone does not establish direct competition.

Connections (5)

Every connection below is tied to a readable source, date, classification and statement of its limits. A company source establishes what that company stated; it does not necessarily provide independent confirmation.

Current relationships (3)

Amkor Technology provides advanced packaging services to AMD
Manufactures forCurrent
Amkor Technology is partnering with AMD on advanced chip packaging that bundles multiple dies for data-center processors, part of Amkor's expanding advanced-packaging customer base including its new Arizona campus.

Source: 2026-05-21 · reviewed 2026-09-20

Evidence: Secondary reporting of an on-record executive statement · Active partnership as of May 2026 reporting; new Arizona packaging campus targeted to begin production in 2028

Limits: Based on Reuters reporting with an on-record Amkor CEO quote; does not disclose contract terms, packaging volumes, or which specific AMD products are involved.

Amkor working with AMD on advanced packaging after acquiring more land in Arizona ↗
Amkor Technology manufactures advanced packaging for Marvell Technology
Manufactures forCurrent
Marvell's advanced packaging platform announcement for custom AI accelerators includes an on-record statement from Amkor Technology's COO describing Amkor's 2.5D packaging technology enabling integration of chiplet and memory modules for Marvell's custom silicon designs.

Source: 2025-05-29 · reviewed 2026-09-22

Evidence: Primary-source statement · Reported operating

Limits: Confirms Amkor packaging technology is part of Marvell's platform ecosystem; does not establish which specific Marvell products use Amkor packaging or order volumes.

Marvell Delivers Advanced Packaging Platform for Custom AI Accelerators ↗
Amkor Technology provides packaging and test manufacturing for Qualcomm
Manufactures forCurrent
Amkor Technology has provided packaging and test support for Qualcomm's premium-tier mobile communications products, with Qualcomm describing Amkor as 'an important supplier' in its supply chain and naming it a 2015 Supplier of the Year.

Source: 2016-06-21 · reviewed 2026-09-22

Evidence: Primary-source statement · Reported operating

Limits: A 2016 supplier-award announcement; does not establish current production volumes, exclusivity, or whether this relationship remains active today.

Amkor Technology Receives Qualcomm Technologies' 2015 Supplier of the Year Award ↗

Dated or announced (2)

Amkor Technology provides advanced packaging and test manufacturing for TSMC
Manufactures forDated / announced
Amkor Technology and TSMC signed a 10-year partnership under which TSMC will procure advanced packaging and test services from Amkor, with both companies building facilities in Arizona to create a full U.S. semiconductor supply chain from silicon manufacturing to packaged devices.

Source: 2026-06-16 · reviewed 2026-09-22

Evidence: Primary-source statement · Announced / planned

Limits: Does not disclose contract value, packaging volumes, or the share of TSMC's total advanced-packaging demand Amkor will fulfill; the Arizona facilities are still under development.

TSMC and Amkor Technology Announce Long Term Partnership to Accelerate Advanced Packaging in the United States ↗
Amkor Technology plans packaging for NVIDIA
Manufactures forDated / announced
Amkor was named in the Arizona packaging and testing plan.

Source: 2025-04-14 · reviewed 2026-09-17

Evidence: Primary-source statement · Announced plan

Limits: No completion or production-volume evidence in this announcement.

NVIDIA US manufacturing announcement ↗
Evidence for this profile

Amkor investor relations ↗
Reviewed

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Inclusion in this database is not an endorsement of a company or its securities. Nothing here is a recommendation to buy or sell anything, and none of it is individualized investment advice. See the disclosures. Data: AI Map v3.22, released .