COMPANIES · CHIP EQUIPMENT

Besi

Dutch maker of chip assembly equipment, the die-attach and bonding machines that place and join chips inside a package, including hybrid bonding tools.

EnablerChip equipment
What it does

Dutch maker of chip assembly equipment, the die-attach and bonding machines that place and join chips inside a package, including hybrid bonding tools.

Why it matters

Hybrid bonding stacks chips with direct copper-to-copper connections, a technique used in advanced packaging for AI processors and next-generation memory; Besi attributed its first-half 2026 growth to higher demand for AI computing applications.

How it makes money

Sells die attach, packaging and plating equipment plus parts and services to chipmakers and assembly subcontractors.

Geography

Netherlands (Duiven)

AI stack position

Semiconductor manufacturing equipment. The highly specialized machines and design software used to create advanced chips in the first place. Without these tools, no chip maker in the world — including the ones building NVIDIA's chips — could produce anything.

Same-layer peers

Same-layer peers share an editorial stack classification; that alone does not establish direct competition.

Connections (2)

Every connection below is tied to a readable source, date, classification and statement of its limits. A company source establishes what that company stated; it does not necessarily provide independent confirmation.

Current relationships (2)

Applied Materials bought a 9% stake in Besi
Invested inCurrent
Applied Materials said it purchased 9 percent of Besi's outstanding shares as a strategic, long-term investment.

Source: 2025-04-14 · reviewed 2026-09-26

Evidence: Primary-source statement · Completed stake purchase (April 2025)

Limits: Describes the April 2025 purchase; does not establish Applied's current holding, board influence or any control. Press reports in March 2026 of takeover interest were unconfirmed and are not reflected here.

Applied Materials Announces a Strategic Investment in BE Semiconductor Industries ↗
Besi co-develops hybrid bonding equipment with Applied Materials
Co-develops withCurrent
Applied Materials said it and Besi have worked together since 2020 on hybrid bonding and recently extended their agreement to develop an integrated equipment solution for die-based hybrid bonding.

Source: 2025-04-14 · reviewed 2026-09-26

Evidence: Primary-source statement · Reported operating

Limits: Stated by Applied; does not establish revenue split, shipments of the integrated solution or which chipmakers use it.

Applied Materials Announces a Strategic Investment in BE Semiconductor Industries ↗

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Inclusion in this database is not an endorsement of a company or its securities. Nothing here is a recommendation to buy or sell anything, and none of it is individualized investment advice. See the disclosures. Data: AI Map v3.24, released .